3PEAK (688536) has unveiled the TPC2400, a 32‑channel, 14‑bit high‑voltage DAC purpose‑built for optical circuit switching (OCS) in AI superclusters and hyperscale data centers.

The chip integrates 14‑bit DAC, high‑voltage output amplifiers (up to 200V full‑scale), sampling ADC, load switches, independent channel shutoff, and fault alarms – all in one package, tailored for MEMS‑based OCS systems requiring dense, high‑voltage control for long‑term reliability.

OCS enables all‑optical routing at the physical layer, bypassing power‑hungry electrical switches. As GPU clusters scale from 10K to 100K+ nodes, hyperscalers are deploying OCS in spine/backbone links to enable dynamic network reconfiguration and break the power/thermal limits of traditional electrical switching.

MEMS micromirrors require tens to hundreds of volts for electrostatic actuation. Conventional designs rely on low‑voltage DACs + numerous external high‑voltage op‑amps, consuming large board space. The TPC2400 eliminates that complexity in a single chip. The device is already in customer validation with multiple partners.

ICgoodFind Takeaway:
3PEAK’s TPC2400 fills a critical gap in MEMS‑OCS drive silicon. It could accelerate the deployment of all‑optical switch hardware in China’s AI compute centers.